The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Jan. 17, 2014
Applicant:
Corning Incorporated, Corning, NY (US);
Inventors:
Kristen Marie Horn, Painted Post, NY (US);
David Myron Lineman, Painted Post, NY (US);
Kevin Thomas Morris, Hammondsport, NY (US);
Wenchao Wang, Ithaca, NY (US);
Assignee:
Corning Incorporated, Corning, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01); C03B 40/00 (2006.01); C03B 11/00 (2006.01); C03B 23/035 (2006.01); C23C 8/10 (2006.01); C03B 40/02 (2006.01); C03B 23/025 (2006.01); C03B 23/03 (2006.01); C03B 23/00 (2006.01); C03B 23/023 (2006.01);
U.S. Cl.
CPC ...
C03B 40/00 (2013.01); C03B 11/00 (2013.01); C03B 23/002 (2013.01); C03B 23/023 (2013.01); C03B 23/0252 (2013.01); C03B 23/0302 (2013.01); C03B 23/0355 (2013.01); C03B 23/0357 (2013.01); C03B 40/02 (2013.01); C23C 8/10 (2013.01); Y02P 40/57 (2015.11);
Abstract
The present disclosure relates to high purity nickel molds for use in forming three dimensional glass substrates, along with methods of making three dimensional glass substrates. The mold compositions minimize imperfections in the formed glass substrates providing optical quality shaped glass articles for use in electronics applications.