The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Nov. 23, 2010
Applicants:
Andreas Pruemm, Stuttgart, DE;
Karl-heinz Kraft, Herrenberg, DE;
Thomas Mayer, Reutlingen, DE;
Arnim Hoechst, Reutlingen, DE;
Christoph Schelling, Stuttgart, DE;
Inventors:
Andreas Pruemm, Stuttgart, DE;
Karl-Heinz Kraft, Herrenberg, DE;
Thomas Mayer, Reutlingen, DE;
Arnim Hoechst, Reutlingen, DE;
Christoph Schelling, Stuttgart, DE;
Assignee:
Robert Bosch GmbH, Stuttgart, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); B81C 1/00 (2006.01); B81C 3/00 (2006.01); B81B 7/00 (2006.01); H01L 21/683 (2006.01); G01L 19/00 (2006.01); G01L 9/00 (2006.01); G01P 15/08 (2006.01); G01P 15/12 (2006.01); G01P 15/125 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00301 (2013.01); B81B 7/007 (2013.01); B81C 3/008 (2013.01); G01L 9/0048 (2013.01); G01L 19/0076 (2013.01); G01P 15/0802 (2013.01); G01P 15/123 (2013.01); G01P 15/125 (2013.01); H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 24/94 (2013.01); H01L 24/97 (2013.01); B81C 2203/035 (2013.01); B81C 2203/051 (2013.01); G01P 2015/084 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/056 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/157 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01);
Abstract
A method for producing a semiconductor component () is proposed. The method comprises the following steps: