The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Oct. 21, 2013
Johannes Classen, Reutlingen, DE;
Axel Franke, Wannweil, DE;
Jens Frey, Filderstadt, DE;
Heribert Weber, Nuertingen, DE;
Frank Fischer, Gomaringen, DE;
Patrick Wellner, Walddorfhaeslach, DE;
Mirko Hattass, Stuttgart, DE;
Daniel Christoph Meisel, Reutlingen, DE;
Johannes Classen, Reutlingen, DE;
Axel Franke, Wannweil, DE;
Jens Frey, Filderstadt, DE;
Heribert Weber, Nuertingen, DE;
Frank Fischer, Gomaringen, DE;
Patrick Wellner, Walddorfhaeslach, DE;
Mirko Hattass, Stuttgart, DE;
Daniel Christoph Meisel, Reutlingen, DE;
ROBERT BOSCH GMBH, Stuttgart, DE;
Abstract
A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.