The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
May. 03, 2011
Mathias Hansel, Rummingen, DE;
Frederic Laure, Gomez la Ville, FR;
Olivier Daverio, Folgensburg, FR;
Mathias Hansel, Rummingen, DE;
Frederic Laure, Gomez la Ville, FR;
Olivier Daverio, Folgensburg, FR;
A. Raymond Et Cie, Grenoble, FR;
Abstract
A method for the attachment of a formed adhesive element (') to a hot bonding part () in a practical and efficient way is disclosed. The formed adhesive element may be attached to the hot bonding part by the end-user prior to attachment of the hot bonding part to the substrate. In order to attach the formed adhesive element (′) to the bonding part according to the disclosed invention, the bonding part () is heated then is moved in position over the formed adhesive element positioned on a detent of a matrix plate (). Thereafter the hot bonding part is moved into contact with the formed adhesive element or the formed adhesive element is moved against the hot bonding part. The bonding part, now having the formed adhesive element attached, is ready for attachment to the substrate. One or more formed adhesive elements may be attached to the bonding part. Attachment of the formed adhesive elements to the bonding part may be done manually or mechanically.