The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Dec. 16, 2011
Applicant:

Naoya Tabuchi, Tochigi, JP;

Inventor:

Naoya Tabuchi, Tochigi, JP;

Assignee:

YACHIYO INDUSTRY CO., LTD., Sayama-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B29C 51/12 (2006.01); B29C 51/26 (2006.01); B29C 65/02 (2006.01); B29C 65/78 (2006.01); B29C 69/00 (2006.01); B29D 22/00 (2006.01); B60K 15/03 (2006.01); B29C 49/04 (2006.01); B29C 49/22 (2006.01); B29C 49/00 (2006.01); B29C 49/20 (2006.01); B29K 23/00 (2006.01); B29K 105/20 (2006.01); B29K 659/00 (2006.01); B29L 22/00 (2006.01); B29L 31/30 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 66/532 (2013.01); B29C 51/12 (2013.01); B29C 51/267 (2013.01); B29C 65/028 (2013.01); B29C 65/7814 (2013.01); B29C 66/126 (2013.01); B29C 66/1312 (2013.01); B29C 66/30325 (2013.01); B29C 66/54 (2013.01); B29C 66/543 (2013.01); B29C 66/61 (2013.01); B29C 66/92655 (2013.01); B29C 69/004 (2013.01); B29D 22/003 (2013.01); B29C 49/04 (2013.01); B29C 49/22 (2013.01); B29C 66/3494 (2013.01); B29C 66/71 (2013.01); B29C 66/712 (2013.01); B29C 66/7234 (2013.01); B29C 66/8242 (2013.01); B29C 66/8322 (2013.01); B29C 66/83221 (2013.01); B29C 66/919 (2013.01); B29C 66/91411 (2013.01); B29C 66/92445 (2013.01); B29C 2049/0057 (2013.01); B29C 2049/2008 (2013.01); B29C 2049/2013 (2013.01); B29C 2049/2047 (2013.01); B29C 2049/2078 (2013.01); B29C 2791/001 (2013.01); B29C 2791/006 (2013.01); B29C 2791/007 (2013.01); B29K 2023/065 (2013.01); B29K 2105/203 (2013.01); B29K 2659/00 (2013.01); B29L 2022/00 (2013.01); B29L 2031/30 (2013.01); B29L 2031/7172 (2013.01); B60K 15/03177 (2013.01); B60K 2015/03032 (2013.01); B60K 2015/0346 (2013.01); B60K 2015/03453 (2013.01); B60K 2015/03467 (2013.01); Y10T 29/49826 (2015.01);
Abstract

The present invention provides a structure for clamping a built-in component in a hollow container, the container being formed by clamp molding using a pair of a first mold piece and a second mold piece, the first mold piece being for forming a first half of the container, the second mold piece being for forming a second half of the container, the structure comprising: a first support member secured to an inner wall surface of the first half of the container and having a first connection portion and a first clamp portion; a second support member secured to an inner wall surface of the second half of the container having a second connection portion and a second clamp portion, wherein the built-in component is clamped between the first support member and the second support member with the first connection portion and the second connection portion coupled to each other.


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