The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Jun. 23, 2014
Applicant:

Xerox Corporation, Norwalk, CT (US);

Inventors:

James R. Beachner, Ontario, NY (US);

Jing Zhou, Pittsford, NY (US);

Mandakini Kanungo, Penfield, NY (US);

Nancy Y. Jia, Webster, NY (US);

Paul J. McConville, Webster, NY (US);

Wei Hong, Amherst, MA (US);

Assignee:

Xerox Corporation, Norwalk, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/75 (2006.01); B01L 3/00 (2006.01); B32B 41/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/5023 (2013.01); B32B 41/00 (2013.01); B01L 2300/126 (2013.01); B01L 2300/161 (2013.01); B32B 2307/73 (2013.01); B32B 2317/12 (2013.01); Y10T 156/1741 (2015.01);
Abstract

An apparatus for bonding two substrates includes a first roller, a second roller that forms a nip with the first roller, a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously, and a controller. The controller operates the substrate transport to move the first substrate and the second substrate through the nip simultaneously, with a pattern of a hydrophobic material on a first side of the first substrate engaging a first side of the second substrate. The first substrate engages the first roller, which has a higher temperature than the second roller, and the hydrophobic material penetrates the first and second substrates to bond the substrates together.


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