The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Nov. 30, 2010
Chi Hee Ahn, Seoul, KR;
Sang Myung Lee, Seoul, KR;
Yeong Uk Seo, Seoul, KR;
Jin Su Kim, Seoul, KR;
Sung Woon Yoon, Seoul, KR;
Myoung Hwa Nam, Seoul, KR;
Chi Hee Ahn, Seoul, KR;
Sang Myung Lee, Seoul, KR;
Yeong Uk Seo, Seoul, KR;
Jin Su Kim, Seoul, KR;
Sung Woon Yoon, Seoul, KR;
Myoung Hwa Nam, Seoul, KR;
LG INNOTEK CO., LTD., Seoul, KR;
Abstract
An embedded PCB, a multi-layer PCB using the embedded PCB, and a method of manufacturing the same are provided. The method of manufacturing an embedded PCB includes a first step of patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the insulating layer are selectively etched to form a circuit pattern region and a second step of filling the circuit pattern region with a plating material to form a circuit pattern. Accordingly, the method of manufacturing an embedded PCB can simultaneously or sequentially etch a photoresist layer and an insulating layer using a laser to form a circuit pattern so as to obtain a micro pattern and simplify a manufacturing process and achieve alignment accuracy in construction of a multi-layer PCB using the embedded PCB to thereby improve product reliability and yield.