The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Mar. 27, 2014
Taiyo Ink Mfg. Co., Ltd., Hiki-gun, JP;
Masayuki Shimura, Hiki-gun, JP;
Yoshiyuki Furuta, Hiki-gun, JP;
Masao Yumoto, Osato-gun, JP;
Shoji Minegishi, Hiki-gun, JP;
Taiyo Ink Mfg. Co., Ltd., Hiki-gun, JP;
Abstract
A curable composition to be used for a printed wiring board is disclosed, which has an excellent flexibility and an excellent adhesive property with respect to both a plastic substrate and a conductive layer in the printed wiring board. The curable composition includes (A) a (meth)acrylate compound having a polyene structure, (B) a (meth)acrylate compound having a hydroxyl group; and (C) a photopolymerization initiator. From the curable composition, a cured coating film, and a printed wiring board including the cured coating film in the form of a predetermined pattern are obtained.