The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Mar. 15, 2013
Applicant:
Kulite Semiconductor Products, Inc., Leonia, NJ (US);
Inventors:
Lou Derosa, Wayne, NJ (US);
Robert Gardner, Westwood, NJ (US);
Assignee:
KULITE SEMICONDUCTOR PRODUCTS, INC., Leonia, NJ (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); G01L 15/00 (2006.01); H05K 7/00 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01); H01L 23/28 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); G01L 15/00 (2013.01); H05K 1/189 (2013.01); H05K 1/0393 (2013.01); H05K 1/115 (2013.01); H05K 1/118 (2013.01); H05K 2201/1028 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/2009 (2013.01);
Abstract
This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor.