The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Jul. 31, 2014
Applicant:

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Inventors:

Hiroshi Inada, Sakai, JP;

Masaki Migita, Fujisawa, JP;

Yasuhiro Iguchi, Yokohama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/378 (2011.01); H04N 5/33 (2006.01); H04N 5/361 (2011.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H04N 5/378 (2013.01); H04N 5/2257 (2013.01); H04N 5/33 (2013.01); H04N 5/361 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73257 (2013.01);
Abstract

An optical sensor apparatus includes a package having a window; a sensor chip having an array of light receiving devices and a pixel electrode connected to each light receiving device, the sensor chip having an incidence surface that faces the window of the package; and a read-out circuit disposed under the sensor chip, the read-out circuit having a read-out electrode electrically connected to each pixel electrode of the sensor chip. The sensor chip and the read-out circuit are housed in the package. In plan view from the sensor chip, the read-out circuit is overlapped by the sensor chip, and the read-out circuit has no portion extending off the sensor chip.


Find Patent Forward Citations

Loading…