The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Aug. 14, 2014
Applicant:

Rockwell Automation Technologies, Inc., Mayfield Heights, OH (US);

Inventors:

Zoran Vrankovic, Greenfield, WI (US);

Rongjun Huang, Saint Louis, MO (US);

Mark Cooper, Eden Prairie, MN (US);

David M Brod, Bloomington, MN (US);

Assignee:

Rockwell Automation Technologies, Inc., Mayfield Heights, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02P 31/00 (2006.01); H02P 7/00 (2006.01); H02K 11/00 (2006.01);
U.S. Cl.
CPC ...
H02K 11/0047 (2013.01); H02K 11/0073 (2013.01);
Abstract

A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the motor drive may be mounted. The power electronic devices are mounted to the base plate through the direct bond copper (DBC). A circuit board is mounted to the base plate which includes a temperature sensor mounted on the circuit board proximate to the power electronic devices. The temperature sensor generates a digital signal corresponding to the temperature measured by the sensor. A copper pad is included between each layer of the circuit board and between the first layer of the circuit board and the sensor. The circuit board also includes vias extending through each layer of the board. The copper pads and vias establish a thermally conductive path between the temperature sensor and the base plate.


Find Patent Forward Citations

Loading…