The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
May. 29, 2008
Applicants:
Kazuo Yoshida, Tokyo, JP;
Kyota Susai, Tokyo, JP;
Takeo Uno, Tokyo, JP;
Shuichi Kitagawa, Tokyo, JP;
Kengo Mitose, Tokyo, JP;
Inventors:
Kazuo Yoshida, Tokyo, JP;
Kyota Susai, Tokyo, JP;
Takeo Uno, Tokyo, JP;
Shuichi Kitagawa, Tokyo, JP;
Kengo Mitose, Tokyo, JP;
Assignee:
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); C25D 5/50 (2006.01); H01R 13/03 (2006.01); C25D 5/12 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); C25D 5/12 (2013.01); C25D 5/50 (2013.01); C25D 7/00 (2013.01); Y10T 428/12458 (2015.01);
Abstract
A metallic material for an electrical electronic includes a CU—Sun alloy layer () provided on a conductive base (). A Cu concentration of the Cu—Sn alloy layer gradually decreases from the base side to the surface () side.