The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Jun. 07, 2013
Applicant:

Flextronics Ap, Llc, Broomfield, CO (US);

Inventors:

Dason Cheung, Fremont, CA (US);

Murad Kurwa, San Jose, CA (US);

Richard Loi, San Jose, CA (US);

Assignee:

Flextronics AP, LLC, Broomfield, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01L 31/18 (2006.01); B23K 1/00 (2006.01); B23K 3/04 (2006.01); B23K 1/012 (2006.01); B23K 1/002 (2006.01); B23K 3/08 (2006.01);
U.S. Cl.
CPC ...
H01L 31/18 (2013.01); B23K 1/002 (2013.01); B23K 1/0016 (2013.01); B23K 1/012 (2013.01); B23K 3/04 (2013.01); B23K 3/08 (2013.01);
Abstract

A solar cell module comprises a solar cell soldered to a mounting element, such as a ceramic substrate. The solder bond can comprise a void. A method of reducing a solder void comprises reflowing the solder using a vacuum source and a heat source in a sealed chamber. The chamber is formed, at least in part, by a cowling into which the solar cell module is mounted. A system for reducing voids in a solder bond comprises a heat source and a vacuum source coupled to the sealed chamber into which a solar cell module is placed. The system can optionally include a control system that automates the execution of methods of reducing solder voids. The system can further include a pressure source to aid in reducing the solder void and reflowing the solder after the void is reduced.


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