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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9263536 B1

PDFFull Text
Date of Patent:
Feb. 16, 2016

Filed:

Oct. 24, 2013

Methods of fabricating semiconductor devices with electrode support patterns

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hong-Gun Kim, Hwaseong-si, KR;

Young-Min Ko, Hwaseong-si, KR;

Kwang-Tae Hwang, Seoul, KR;

Assignee:

Samsung Electronics Co., Ltd., , KR;

Attorney:

Myers Bigel Sibley & Sajovec, P.A.

Primary Examiner:

Thanhha Pham

Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 31/119 (2006.01); H01L 29/423 (2006.01); H01L 49/02 (2006.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4236 (2013.01); H01L 27/10814 (2013.01); H01L 27/10852 (2013.01); H01L 28/92 (2013.01); H01L 21/28008 (2013.01); H01L 27/10823 (2013.01);
Abstract

Methods include sequentially forming a first mold film, a first support film, a second mold film, and a second support film on a substrate, forming a contact hole through the second support film, the second mold film, the first support film and the first mold film, forming an electrode in the contact hole, and removing portions of the second support film, the second mold film and the first mold film to leave a portion of the first support film as a first support pattern surrounding the electrode and to leave a portion of the second support film as a second support pattern surrounding the electrode.

Find Patent Forward Citations

Kim, Hong-Gun. (2016). Methods of fabricating semiconductor devices with electrode support patterns (U.S. Patent No. 9263536). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9263536

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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