The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Feb. 28, 2014
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Boon Seong Lee, Melaka, MY;

Chee Voon Tan, Seremban, MY;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01);
Abstract

A semiconductor device includes a chip carrier having a first surface and a second surface opposite to the first surface. The device further includes a first semiconductor chip mounted on the first surface of the chip carrier. A second semiconductor chip is mounted on the second surface of the chip carrier, wherein a portion of a first surface of the second semiconductor chip which faces the chip carrier projects over an edge of the chip carrier. A first electrical conductor is coupled to an electrode formed on the portion of the first surface of the second semiconductor chip that projects over the edge of the chip carrier.


Find Patent Forward Citations

Loading…