The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Apr. 06, 2015
Applicant:
Cypress Semiconductor Corporation, San Jose, CA (US);
Inventor:
Bo Soon Chang, Cupertino, CA (US);
Assignee:
Cypress Semiconductor Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/4828 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49579 (2013.01); H01L 24/49 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54413 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/14 (2013.01); H01L 2924/17747 (2013.01);
Abstract
Described is a semiconductor package frame including a material comprising wire openings a die-mounting surface area with a die-mounting surface and identification markings included within the die-mounting surface. The identification markings uniquely identify the semiconductor package frame from among other semiconductor package frames comprising different identification markings.