The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

May. 23, 2013
Applicant:

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Inventor:

Jiro Shinkai, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 23/50 (2006.01); H01L 25/00 (2006.01); H01L 23/053 (2006.01); H01L 23/40 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01L 23/053 (2013.01); H01L 25/50 (2013.01); H01L 23/373 (2013.01); H01L 23/4006 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/85 (2013.01); H01L 25/072 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85411 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19107 (2013.01); Y10T 29/49128 (2015.01);
Abstract

A semiconductor module according to one embodiment includes a semiconductor chip, a wiring substrate, a mounting plate provided with the wiring substrate thereon, a frame body defining a case for the wiring substrate, together with the mounting plate, a bus bar extending from the case and being inserted into a side wall of the frame. The side wall has a projection. The bus bar includes a first region in the side wall, a second region extending from a first end of the first region outward from the frame, a third region extending from a second end of the first region into the frame. The third region is bent based on the shape being close to the wiring substrate of the projection. The mounting plate with the wiring substrate is attached to the frame such that the third region is in press-contact with the wiring pattern.


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