The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Sep. 12, 2011
Masachika Masuda, Tokorozawa, JP;
Koji Tomita, Kawagoe, JP;
Tadashi Okamoto, Tokyo-to, JP;
Yasunori Tanaka, Asaka, JP;
Hiroshi Ohsawa, Saitama, JP;
Kazuyuki Miyano, Sayama, JP;
Atsushi Kurahashi, Tsurugashima, JP;
Hiromichi Suzuki, Machida, JP;
Masachika Masuda, Tokorozawa, JP;
Koji Tomita, Kawagoe, JP;
Tadashi Okamoto, Tokyo-to, JP;
Yasunori Tanaka, Asaka, JP;
Hiroshi Ohsawa, Saitama, JP;
Kazuyuki Miyano, Sayama, JP;
Atsushi Kurahashi, Tsurugashima, JP;
Hiromichi Suzuki, Machida, JP;
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Abstract
A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region.