The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Aug. 30, 2012
Applicants:

Kevin Ptasienski, O'Fallon, MO (US);

Kevin Robert Smith, Columbia, MO (US);

Cal Thomas Swanson, St. Louis, MO (US);

Philip Steven Schmidt, Winona, MN (US);

Mohammad Nosrati, Fenton, MO (US);

Jacob Robert Lindley, St. Louis, MO (US);

Allen Norman Boldt, Kirkwood, MO (US);

Sanhong Zhang, Ballwin, MO (US);

Louis P. Steinhauser, St. Louis, MO (US);

Dennis Stanley Grimard, Ann Arbor, MI (US);

Inventors:

Kevin Ptasienski, O'Fallon, MO (US);

Kevin Robert Smith, Columbia, MO (US);

Cal Thomas Swanson, St. Louis, MO (US);

Philip Steven Schmidt, Winona, MN (US);

Mohammad Nosrati, Fenton, MO (US);

Jacob Robert Lindley, St. Louis, MO (US);

Allen Norman Boldt, Kirkwood, MO (US);

Sanhong Zhang, Ballwin, MO (US);

Louis P. Steinhauser, St. Louis, MO (US);

Dennis Stanley Grimard, Ann Arbor, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F27B 5/14 (2006.01); H05B 3/28 (2006.01); H01L 21/67 (2006.01); H05B 3/20 (2006.01); H05B 1/02 (2006.01); H05B 1/00 (2006.01); H05B 3/02 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H01L 21/6833 (2013.01); H05B 1/00 (2013.01); H05B 1/02 (2013.01); H05B 1/0202 (2013.01); H05B 1/0227 (2013.01); H05B 1/0233 (2013.01); H05B 3/02 (2013.01); H05B 3/20 (2013.01); H05B 2213/03 (2013.01); Y10T 156/10 (2015.01);
Abstract

An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.


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