The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Jul. 01, 2008
Watanabe Tomohiro, Aizuwakamatsu, JP;
Fumihiko Inoue, Aizuwakamatsu, JP;
Watanabe Tomohiro, Aizuwakamatsu, JP;
Fumihiko Inoue, Aizuwakamatsu, JP;
Cypress Semiconductor Corporation, San Jose, CA (US);
Abstract
The present invention is directed to a method and an apparatus for manufacturing a semiconductor device including step Sto form an insulating film on a front surface of a semiconductor wafer that is a surface on which a semiconductor element is to be formed and on a back surface that is a surface opposing the front surface, step Sto remove the insulating film formed on the back surface by selectively providing a first chemical on the back surface of the semiconductor wafer, and step Sto remove the insulating film formed on the front surface by simultaneously immersing the plurality of semiconductor wafers in a second chemical.