The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Nov. 22, 2010
Shinji Otani, Amagasaki, JP;
Akihiro Nomura, Moriyama, JP;
Shinji Otani, Amagasaki, JP;
Akihiro Nomura, Moriyama, JP;
MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Abstract
A conductive resin composition which allows a resin electrode which is favorable in terms of shape and adhesion to a ceramic device to be formed reliably, and a chip-type electronic component including resin electrodes formed with the conductive resin component are described. The conductive resin composition contains a linear bifunctional epoxy resin having a molecular weight of 11000 to 40000 and a terminal glycidyl group, a conductive silver powder, and a solvent, and has a yield value of 3.6 Pa or less. In addition, the conductive powder can have a surface attached to a fatty acid or a salt thereof, and the ratio of the fatty acid or salt thereof to the conductive powder is 0.5 wt % or less. Furthermore, the conductive powder can be spherical, and the ratio of the conductive powder in solids constituting the conductive resin composition can be 42 to 54 vol %.