The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Feb. 16, 2012
Applicant:
Atoosa Lotfi, Valencia, CA (US);
Inventor:
Atoosa Lotfi, Valencia, CA (US);
Assignee:
ADVANCED BIONICS AG, Staefa, CH;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/00 (2006.01); H01B 7/04 (2006.01); A61N 1/05 (2006.01); B23K 26/08 (2014.01); B23K 26/20 (2014.01); B23K 26/36 (2014.01); B23K 26/40 (2014.01); B29C 47/00 (2006.01); B29C 47/88 (2006.01); B29C 37/00 (2006.01); B29K 83/00 (2006.01); H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
H01B 7/048 (2013.01); A61N 1/0541 (2013.01); B23K 26/0823 (2013.01); B23K 26/20 (2013.01); B23K 26/367 (2013.01); B23K 26/4075 (2013.01); B29C 47/003 (2013.01); B29C 47/8805 (2013.01); A61N 1/0551 (2013.01); B23K 2201/32 (2013.01); B23K 2201/38 (2013.01); B29C 37/0053 (2013.01); B29K 2083/00 (2013.01); H01B 13/0013 (2013.01);
Abstract
A method for forming a wire construct includes forming a groove in a polymer having a mouth that is narrower than a width of a deeper portion of the groove and placing a substantial length of wire in the groove, the wire having a larger cross-sectional dimension than the mouth of the groove. Encapsulant is placed over the polymer. The wire construct is to be used for implantable stimulation leads, such as a cochlear stimulation lead or a neurostimulation lead. Two wire constructs can be assembled to form a multilayer wire construct.