The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Jun. 17, 2013
Applicants:

Carol Anne Handwerker, West Lafayette, IN (US);

Suk Jun Kim, West Lafayette, IN (US);

Eric A. Stach, West Lafayette, IN (US);

Inventors:

Carol Anne Handwerker, West Lafayette, IN (US);

Suk Jun Kim, West Lafayette, IN (US);

Eric A. Stach, West Lafayette, IN (US);

Assignee:

Purdue Research Foundation, West Lafayette, IN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 7/00 (2006.01); H01B 1/02 (2006.01); B22F 1/00 (2006.01); B22F 1/02 (2006.01); B22F 3/12 (2006.01); C22C 1/04 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
H01B 1/02 (2013.01); B22F 1/0018 (2013.01); B22F 1/025 (2013.01); B22F 3/12 (2013.01); B82Y 30/00 (2013.01); C22C 1/0425 (2013.01); Y10T 428/12014 (2015.01);
Abstract

A sintered structure and method for forming it are disclosed. The method includes obtaining core-shell particles having a core material and a shell material, forming the particles into a powder compact, and annealing the powder compact at an annealing temperature. The shell material is a metal that diffuses faster than the core material at the annealing temperature and diffuses to the contacts between the core-shell particles during annealing to form sintered interfaces between the core-shell particles. The sintered structure can have discontinuous regions of shell material between the sintered interfaces. The core material can be a metal, semiconductor or ceramic. The core material can be copper and the shell material can be silver. The sintered interfaces can be almost purely shell material. The annealing temperature can be significantly lower than the temperature needed to form interfaces between particles of the core material without the shell material.


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