The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Sep. 05, 2013
Applicant:

Dell Products, L.p., Round Rock, TX (US);

Inventors:

David William Grunow, Round Rock, TX (US);

Daniel William Kehoe, Cedar Park, TX (US);

Matthew B. Mendelow, Austin, TX (US);

Assignee:

DELL INC., Round Rock, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H01L 23/34 (2006.01); H01L 23/427 (2006.01); H05K 7/20 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); G06F 1/203 (2013.01); H01L 23/34 (2013.01); H01L 23/427 (2013.01); H05K 7/20809 (2013.01); H01L 23/4006 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49126 (2015.01);
Abstract

Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and a daughterboard coupled to the motherboard and including a Graphics Processing Unit (GPU) coupled to a second side of the heat pipe. In other embodiments, a method may include providing a motherboard including a CPU; coupling a cooling system to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and coupling a daughterboard to the motherboard, the daughterboard including a GPU coupled to a second side of the heat pipe.


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