The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Jan. 16, 2013
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

John Fangman, Leesport, PA (US);

Vipulkumar Patel, Breinigsville, PA (US);

Ravinder Kachru, Los Altos Hills, CA (US);

Assignee:

CISCO TECHNOLOGY, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/36 (2006.01); G02B 6/32 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/36 (2013.01); B32B 37/1292 (2013.01); G02B 6/32 (2013.01); G02B 6/4204 (2013.01); G02B 6/4239 (2013.01); G02B 6/4244 (2013.01); G02B 6/4214 (2013.01); G02B 6/4246 (2013.01);
Abstract

An opto-electronic apparatus comprises a substrate for supporting a plurality of components forming an opto-electronic assembly and an optical component attached to the substrate with an adhesive material, such as a solder or epoxy. The optical component is formed to include a plurality of bond slots disposed in parallel across at least a portion of the bottom surface of the optical component, the plurality of bond slots providing a path for a liquid adhesive material and improving the ability to displace the liquid adhesive material as the component is pressed into the surface of the substrate during the attachment process.


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