The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Jun. 10, 2013
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Michael B. McShane, Austin, TX (US);

Perry H. Pelley, Austin, TX (US);

Tab A. Stephens, Austin, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G01R 31/27 (2006.01); G02B 6/42 (2006.01); G02B 6/30 (2006.01); G01R 31/28 (2006.01); H01L 21/66 (2006.01); G01M 11/00 (2006.01);
U.S. Cl.
CPC ...
G01R 31/275 (2013.01); G01M 11/00 (2013.01); G01R 31/2886 (2013.01); G01R 31/2889 (2013.01); G02B 6/30 (2013.01); G02B 6/42 (2013.01); H01L 22/10 (2013.01); H01L 22/12 (2013.01);
Abstract

An optical die probe wafer testing circuit arrangement and associated testing methodology are described for mounting a production test die () and surrounding scribe grid () to a test head () which is positioned over a wafer () in alignment with a die under test () and surrounding scribe grid (), such that one or more optical deflection mirrors () in the test head scribe grid () are aligned with one or more optical deflection mirrors () in the scribe grid () for the die under test () to enable optical die probe testing on the die under test () by directing a first optical test signal () from the production test die (), through the first and second optical deflection mirrors (e.g.,) and to the first die.


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