The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Feb. 07, 2012
Applicants:

Nam Seok OH, Seoul, KR;

Yun Min Cho, Seoul, KR;

Jong Woo Lee, Seoul, KR;

Inventors:

Nam Seok Oh, Seoul, KR;

Yun Min Cho, Seoul, KR;

Jong Woo Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); F21S 8/10 (2006.01); H05K 1/05 (2006.01); H05K 1/18 (2006.01); H01L 25/075 (2006.01); H01L 33/58 (2010.01); F21V 9/16 (2006.01); F21Y 101/02 (2006.01); H05K 3/28 (2006.01); F21V 3/04 (2006.01); F21V 7/22 (2006.01); F21V 13/02 (2006.01);
U.S. Cl.
CPC ...
F21S 48/115 (2013.01); F21S 48/1154 (2013.01); F21S 48/1225 (2013.01); F21S 48/215 (2013.01); F21S 48/2218 (2013.01); H05K 1/05 (2013.01); H05K 1/183 (2013.01); F21V 3/0463 (2013.01); F21V 7/22 (2013.01); F21V 9/16 (2013.01); F21V 13/02 (2013.01); F21Y 2101/02 (2013.01); H01L 25/0753 (2013.01); H01L 33/58 (2013.01); H01L 2224/48091 (2013.01); H05K 3/284 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/10106 (2013.01);
Abstract

Disclosed is a light emitting module including a light emitting device package having a circuit board having a cavity, an insulation substrate arranged in the cavity, with a conductive pattern formed thereon, and at least one light emitting device disposed on the insulation substrate, with being electrically connected with the conductive pattern; and a glass cover located on the light emitting device package, with lateral surfaces, a top surface and an open bottom surface, wherein the light emitting device package and the circuit board are electrically connected with each other.


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