The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Feb. 25, 2010
Applicants:
Michael Dunleavy, Bristol, GB;
Sajad Haq, Glasgow, GB;
Martyn John Hucker, Woolaston, GB;
Inventors:
Assignee:
BAE SYSTEMS PLC, London, GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/16 (2006.01); C23C 18/44 (2006.01);
U.S. Cl.
CPC ...
C23C 18/44 (2013.01); C23C 18/1616 (2013.01); C23C 18/1678 (2013.01);
Abstract
A method for electroless metal deposition on a surface in a finely dimensioned space (e.g. the bore of a hollow fiber) includes introducing into the space an electroless plating solution that has a nil or relatively low plating rate at normal room temperature, and thereafter heating the structure to an elevated temperature for a period sufficient to cause metal to plate on the wall surface. The introducing and heating may be repeated as necessary or desired to build up a specified thickness.