The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Dec. 19, 2014
Applicant:
Invensense, Inc., San Jose, CA (US);
Inventor:
Thomas Goida, Windham, NH (US);
Assignee:
INVENSENSE, INC., San Jose, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 23/495 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B81B 7/0032 (2013.01); B81B 7/0077 (2013.01); H01L 21/50 (2013.01); H01L 23/495 (2013.01); B81B 2201/0257 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. A conductive internal shell with a connection window sits in the cavity. The MEMS device is mounted in the shell and electrically coupled to the lead frame through wire bonds directed through the connection window. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body aligned with a hole in the internal shell.