The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Oct. 11, 2013
Applicant:

The Regents of the University of Michigan, Ann Arbor, MI (US);

Inventors:

John Seymour, Ann Arbor, MI (US);

Mayurachat Ning Gulari, Ann Arbor, MI (US);

Joerg Lahann, Ann Arbor, MI (US);

Daryl Kipke, Dexter, MI (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61N 1/00 (2006.01); A61N 1/05 (2006.01); H01L 23/29 (2006.01); A61N 1/375 (2006.01);
U.S. Cl.
CPC ...
A61N 1/05 (2013.01); H01L 23/293 (2013.01); A61N 1/0551 (2013.01); A61N 1/375 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/3011 (2013.01); Y10T 29/49117 (2015.01); Y10T 29/49156 (2015.01);
Abstract

A method of manufacturing an implantable electronic device, including: providing a silicon wafer; building a plurality of layers coupled to the wafer including an oxide layer coupled to the silicon wafer; a first reactive parylene layer coupled to the oxide layer, an electrode layer coupled to the first reactive parylene layer, and a second reactive parylene layer, coupled to the electrode layer, that chemically bonds to the first reactive polymer layer, and a second polymer layer coupled to the second reactive parylene layer; coating the plurality of layers with an encapsulation, and modifying the encapsulation and at least one of the plurality of layers to expose an electrode site in the electrode layer.


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