The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Jan. 13, 2011
Applicants:
Tsutomu Yasui, Tokyo, JP;
Hisayuki Abe, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
Tomoko Kitamura, Tokyo, JP;
Inventors:
Tsutomu Yasui, Tokyo, JP;
Hisayuki Abe, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
Tomoko Kitamura, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H05K 3/34 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3463 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); B23K 35/3033 (2013.01); H05K 3/3484 (2013.01);
Abstract
A first solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy. An electronic component built-in module may include an electronic component and a substrate on which the electronic component is installed, where a terminal of the electronic component and a terminal of the substrate are joined together by using the lead-free solder.