The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Sep. 29, 2010
Applicants:
Masaichi Inaba, Ushiku, JP;
Masayuki Iwase, Tsukubamirai, JP;
Inventors:
Masaichi Inaba, Ushiku, JP;
Masayuki Iwase, Tsukubamirai, JP;
Assignee:
NIPPON MEXTRON, LTD., Tokyo-To, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/24 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/244 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/01079 (2013.01); H05K 3/3452 (2013.01); H05K 2201/099 (2013.01); Y10T 29/49155 (2015.01);
Abstract
It is an object to form a conductive intermediate layer having a function of maximally preventing a solder leaching phenomenon with a low environment load and with good productivity. There are provided an insulative base material, a wiring circuit patternformed on at least one surface of the insulative base material, an electronic part mounting landwhich is formed as part of the wiring circuit patternand on which an electronic partis to be mounted, and a conductive intermediate layermade of a sintered conductive ink film on the electronic part mounting land