The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Jul. 25, 2012
Applicants:

Jian Cai, Beijing, CN;

Qian Wang, Beijing, CN;

Ziyu Liu, Beijing, CN;

Yang HU, Beijing, CN;

Inventors:

Jian Cai, Beijing, CN;

Qian Wang, Beijing, CN;

Ziyu Liu, Beijing, CN;

Yang Hu, Beijing, CN;

Assignee:

Tsinghua University, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01J 5/20 (2006.01); H01L 27/14 (2006.01); H01L 31/00 (2006.01); H05K 1/11 (2006.01); G01J 5/02 (2006.01); G01J 5/00 (2006.01); H01L 27/144 (2006.01); H01L 31/02 (2006.01); G01J 5/10 (2006.01); G01J 5/24 (2006.01); H01L 27/146 (2006.01); H01L 21/683 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); G01J 5/00 (2013.01); G01J 5/02 (2013.01); G01J 5/10 (2013.01); G01J 5/20 (2013.01); G01J 5/24 (2013.01); H01L 21/6835 (2013.01); H01L 27/1443 (2013.01); H01L 27/14683 (2013.01); H01L 31/02005 (2013.01); H01L 23/481 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68354 (2013.01); H01L 2224/11002 (2013.01); H05K 2201/032 (2013.01); H05K 2201/0329 (2013.01);
Abstract

A bolometer and a preparation method thereof. The bolometer includes: an infrared detection element () and a readout circuit (), wherein the infrared detection element () is formed on one side of a first substrate (), and an edge of the infrared detection element () is provided with an electrode hole (), and the readout circuit () is formed on one side of a second substrate () and the readout circuit () has an electrode, the first substrate () is formed thereon with a silicon via () passing through the first substrate () and filed with a conductive material, the electrode hole () of the infrared detection element () is electrically connected to the electrode of the readout circuit () via the conductive material filled in the silicon via (). The following defects are overcome: bolometers in the prior art need to flatten the silicon wafer surface with a suitable chemical-mechanical polishing process after a readout circuit thereof has been manufactured, the circuit is large in area, and the requirements of the system integration process are high.


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