The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Sep. 03, 2013
Yazaki Corporation, Tokyo, JP;
Yasushi Katayama, Shizuoka, JP;
YAZAKI CORPORATION, Tokyo, JP;
Abstract
A printed circuit board is designed to meet the following requirements. A front-back copper foil residual rate difference a−b falls within a range of −10% to 10%, where the insulative board is divided into a plurality of divisions, in which front and back surface copper foil residual rates of each division are a % and b %, respectively. A difference (a−b)−(c−d) between front-back copper foil residual rate differences of adjacent divisions falls within a range of −10% to 10%, where the front and back surface copper foil residual rates of a division adjacent to the each division are c % and d %, respectively. There are not three or more consecutive divisions for which the difference between the front-back copper foil residual rate differences goes beyond a range of −5% to 5%.