The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Dec. 25, 2012
Applicant:
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Inventor:
Yu-Hsu Lin, Santa Clara, CA (US);
Assignee:
HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01P 3/04 (2006.01); H01P 3/08 (2006.01); H01P 3/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0245 (2013.01); H01P 3/026 (2013.01); H01P 3/04 (2013.01); H01P 3/08 (2013.01); H05K 1/0219 (2013.01); H05K 3/4617 (2013.01); H05K 2201/0723 (2013.01);
Abstract
A printed circuit board includes an outer signal layer, a first ground layer, a first ground layer located below the outer signal layer, an inner signal layer located below the first ground layer, an second ground layer located below the inner signal layer, and a first differential signal transmission pair and a second differential signal transmission pair laid on the outer signal layer and the inner signal layer. A value h is equal to a distance between the inner signal layer and its closest ground layer. A distance between the first pair and the second pair is not more than h×3.