The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Oct. 29, 2012
Applicants:

Peking University Founder Group Co., Ltd., Beijing, CN;

Zhuhai Founder Tech Hi-density Electronic CO Ltd., Guangdong Province, CN;

Inventors:

Shiqing Huang, Guangdong Province, CN;

Jinhong Li, Guangdong Province, CN;

Xianren Chen, Guangdong Province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); B23P 19/04 (2006.01); H05K 3/02 (2006.01); H01K 3/10 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0237 (2013.01); H05K 1/0216 (2013.01); H05K 1/0268 (2013.01); H05K 1/115 (2013.01); H05K 3/0047 (2013.01); G01R 31/2805 (2013.01); H05K 2201/09781 (2013.01); H05K 2203/0207 (2013.01); H05K 2203/0242 (2013.01); Y10T 29/49155 (2015.01); Y10T 408/03 (2015.01);
Abstract

A method for detecting back-drilled holes in a PCB and a PCB panel are provided. The method comprises: forming, on a metal layer of a first inner layer of a multi-layer PCB, metal rings according to positions of the back-drilled holes during a process of forming the PCB, wherein each of the formed metal rings has an outer diameter greater than an aperture of each of the back-drilled holes; forming, at positions corresponding to the positions of the back-drilled holes, metal holes extending through an outer layer of the PCB and the formed metal rings; forming two first detection holes electrically connected with the formed metal rings; forming the back-drilling holes on the PCB, which extend through and expand the metal holes; and detecting an electrical conduction between the two first detection holes so as to determine whether a position offset exists between the back-drilled holes and the metal holes.


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