The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Aug. 07, 2013
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Inventors:
Young Ki Lee, Suwon, KR;
Bum Seok Suh, Suwon, KR;
Chang Seob Hong, Suwon, KR;
Joon Seok Chae, Suwon, KR;
Kwang Soo Kim, Suwon, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H01L 25/16 (2006.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); H05K 1/05 (2013.01); H01L 25/167 (2013.01); H01L 33/642 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/09972 (2013.01); H05K 2203/0323 (2013.01); Y10T 29/49155 (2015.01);
Abstract
Disclosed herein is a heat radiating substrate including: a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other; a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.