The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Feb. 24, 2014
Applicant:

Tesla Motors, Inc., Palo Alto, CA (US);

Inventors:

Nicholas R. Kalayjian, San Carlos, CA (US);

Joshua Willard Ferguson, Alameda, CA (US);

Benjamin D. Dettmann, San Francisco, CA (US);

Ryan C. Kroeze, San Jose, CA (US);

Michael R. Kubba, Mointain View, CA (US);

William T. Chi, Mountain View, CA (US);

Assignee:

Tesla Motors, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02G 5/00 (2006.01); H01R 43/00 (2006.01); H05K 7/14 (2006.01); H01B 13/00 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H02G 5/00 (2013.01); H01B 13/0036 (2013.01); H05K 7/1432 (2013.01); H02G 5/005 (2013.01); H02M 7/003 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49174 (2015.01); Y10T 29/49224 (2015.01);
Abstract

The bus bar includes a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of the first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of the first dielectric layer and the top surface of the first bus bar layer wherein: the first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of the electrical component and wherein: the first dielectric layer and the second bus bar layer each include a via aligned with the first via wherein the first electrical lead is extendable from beneath the first bus bar layer through the first dielectric layer and through the second bus bar layer.


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