The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Jul. 02, 2013
Applicant:

Gyrus Acmi, Inc., Southborough, MA (US);

Inventors:

Shai Finkman, Haifa, IL;

Adi Navve, Kfar Saba, IL;

Assignee:

GYRUS ACMI, INC., Southborough, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H01R 12/71 (2011.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01); A61B 1/00 (2006.01); H05K 1/11 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H01R 12/712 (2013.01); A61B 1/00131 (2013.01); H01L 24/81 (2013.01); H01L 27/1469 (2013.01); H05K 1/117 (2013.01); H05K 3/368 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09709 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/041 (2013.01); H05K 2203/049 (2013.01);
Abstract

A connector for connection to terminals of an integrated circuit. The connector consists of a dielectric substrate having a first side and a second side. The connector has wire bond terminals which are attached to the first side of the substrate and configured to receive wire bonds connected to a first set of the terminals of the integrated circuit. The connector also has solder bump terminals, attached to the second side of the substrate so as to be insulated from the wire bond terminals, the solder bump terminals being configured to be coupled via solder balls with a second set of the terminals of the integrated circuit.


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