The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Mar. 13, 2009
Applicants:

Gordana Felic, Ringwood North, AU;

Stan Skafidas, Thornbury, AU;

Inventors:

Gordana Felic, Ringwood North, AU;

Stan Skafidas, Thornbury, AU;

Assignee:

Nitero Pty Limited, Fitzroy, AU;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01Q 1/50 (2006.01); H01P 11/00 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/045 (2013.01); H01Q 23/00 (2013.01); Y10T 29/49018 (2015.01);
Abstract

A monolithic antenna element comprises a microstrip patch antenna and a ground plane, with a substrate between the patch antenna and the ground plane. A feeding via extends from the ground plane layer through the substrate to the patch antenna, connecting to the antenna distal from lateral edges of the antenna. A coplanar waveguide (CPW) feed line is formed in the ground plane layer, and interrupts and is electrically distinct from the ground plane. The CPW extends from a lateral edge of the ground layer to the feeding via. The antenna can be flip chip bonded to a CMOS die, reducing cost of millimeter wave transceivers, e.g. 57-64 GHz. The antenna is fabricated using standard PCB technology and a single substrate for the antenna. Antenna arrays can be fabricated. Appropriately designed antenna feeds, flip chip interconnects and antenna shape provide suitably broad antenna bandwidth, with relatively high efficiency.


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