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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9257618 B1

PDFFull Text
Date of Patent:
Feb. 09, 2016

Filed:

Jan. 03, 2012

Led package and method of manufacturing the same

Applicants:

Byoung Gu Cho, Seoul, KR;

Jae-sik Min, Seoul, KR;

Inventors:

Byoung gu Cho, Seoul, KR;

Jae-Sik Min, Seoul, KR;

Assignee:

Lightizer Korea Inc., Seoul, KR;

Attorneys:

Hunter E. Webb

Keohane & D'Alessandro PLLC

Primary Examiner:

Mary Wilczewski

Assistant Examiner:

Tsz Chiu

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/00 (2006.01); H01L 33/50 (2010.01); H01L 27/15 (2006.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/505 (2013.01); H01L 27/156 (2013.01); H01L 33/507 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 33/502 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01);
Abstract

The present invention provides a Light Emitting Diode (LED) package, comprising a Printed Circuit Board (PCB), an LED mounted on the PCB, a pillar placed higher than the LED around the LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED, and a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting the light emitted from the LED into white light by changing a wavelength of the light, wherein an electrical pad of the LED and an electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.

Find Patent Forward Citations

Cho, Byoung. (2016). Led package and method of manufacturing the same (U.S. Patent No. 9257618). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9257618

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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