The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Sep. 24, 2012
Applicant:

Samsung Electronics Co., Ltd., Seoul, KR;

Inventors:

Young Ki Lee, Hwaseong, KR;

Seog Moon Choi, Seoul, KR;

Hyung Jin Jeon, Gunpo, KR;

Sang Hyun Shin, Hwaseong, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B 33/02 (2006.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/647 (2013.01); H01L 33/62 (2013.01); H01L 2224/48227 (2013.01);
Abstract

The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.


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