The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Jul. 29, 2013
Applicant:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Inventors:

Sun Jin Yun, Daejeon, KR;

Chang Bong Yeon, Gyeonggi-do, KR;

Yoo Jeong Lee, Seoul, KR;

JungWook Lim, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/056 (2014.01); H01L 31/0232 (2014.01); H01L 31/18 (2006.01); H01L 31/0224 (2006.01); H01L 31/0236 (2006.01); H01L 51/52 (2006.01); H01L 33/40 (2010.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02327 (2013.01); H01L 31/02366 (2013.01); H01L 31/022425 (2013.01); H01L 31/056 (2014.02); H01L 31/1884 (2013.01); H01L 33/405 (2013.01); H01L 51/5209 (2013.01); H01L 2933/0016 (2013.01); Y02E 10/52 (2013.01);
Abstract

Provided is a method of fabricating an electronic device. The method according to the present inventive concept may include forming a lower electrode having a flat portion and protrusions on a substrate, forming an intermediate layer on the lower electrode, and forming an upper electrode on the intermediate layer. The forming of the lower electrode may include forming a conductive film by depositing a first metal on the substrate, and depositing a second metal on the conductive film to prepare an alloy of the first metal and the second metal.


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