The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Nov. 29, 2010
Yun Tae Lee, Seoul, KR;
Joon Seo Yim, Seoul, KR;
Je Suk Lee, Suwon-si, KR;
Jae Yong Park, Suwon-si, KR;
Jun-woo Park, Seoul, KR;
Su-young Lee, Suwon-si, KR;
Yun Tae Lee, Seoul, KR;
Joon Seo Yim, Seoul, KR;
Je Suk Lee, Suwon-si, KR;
Jae Yong Park, Suwon-si, KR;
Jun-Woo Park, Seoul, KR;
Su-Young Lee, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Abstract
An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.