The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Mar. 10, 2014
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Yosuke Akimoto, Kanagawa-ken, JP;

Akihiro Kojima, Kanagawa-ken, JP;

Miyoko Shimada, Kanagawa-ken, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H05B 33/08 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 24/19 (2013.01); H01L 25/50 (2013.01); H01L 33/50 (2013.01); H01L 33/505 (2013.01); H01L 33/508 (2013.01); H01L 33/0095 (2013.01); H01L 33/502 (2013.01); H01L 33/504 (2013.01); H01L 33/507 (2013.01); H01L 33/56 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0041 (2013.01); H05B 33/0803 (2013.01);
Abstract

According to one embodiment, a semiconductor light emitting device includes not less than three chips. Each of the chips includes a semiconductor layer having a first face, a second face formed on a side opposite to the first face, and a light emitting layer, a p-side electrode, and an n-side electrode. The chips include a central chip centrally positioned in a plan view, and at least two peripheral chips arranged symmetrically to each other sandwiching the central chip in the plan view. A thickness of the fluorescent body layer on the first face is same among the peripheral chips, and the fluorescent body layer on the first face of the central chip and the fluorescent body layers on the first faces of the peripheral chips have thicknesses different from each other.


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