The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Nov. 21, 2012
Applicants:
Takayuki Matsumoto, Fukuoka, JP;
Hirotaka Onishi, Tokyo, JP;
Masuo Koga, Fukuoka, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/50 (2006.01); H01L 23/02 (2006.01); H01L 23/00 (2006.01); H01L 23/60 (2006.01); H01L 23/10 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/544 (2006.01); H01L 23/12 (2006.01); H01L 25/18 (2006.01); H01L 21/56 (2006.01); H01L 25/07 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 21/56 (2013.01); H01L 23/10 (2013.01); H01L 23/12 (2013.01); H01L 23/3107 (2013.01); H01L 23/3128 (2013.01); H01L 23/3735 (2013.01); H01L 23/544 (2013.01); H01L 23/60 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 23/49894 (2013.01); H01L 23/5386 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 25/072 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/4846 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4917 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83132 (2013.01); H01L 2224/8513 (2013.01); H01L 2224/85132 (2013.01); H01L 2224/85801 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/20656 (2013.01);
Abstract
A soldering portion () and a Ni plating mark () are simultaneously forming by plating on a wiring pattern () of an insulating substrate (). A semiconductor chip () is mounted on the insulating substrate (). A position of the insulating substrate () is recognized by the Ni plating mark () and a wire () is bonded to the semiconductor chip (). An electrode () is joined to the soldering portion () by solder (). The insulating substrate (), the semiconductor chip (), the wire (), and the electrode () are encapsulated in an encapsulation material ().