The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Nov. 04, 2014
Samsung Electro-mechanics Co., Ltd., Suwon-Si, KR;
Sung Min Song, Suwon-Si, KR;
Samsung Electro-Mechanics Co., Ltd., Gyeonggi-Do, KR;
Abstract
There are provided a semiconductor package and a method of manufacturing the same. The semiconductor package according to an exemplary embodiment of the present disclosure includes: a substrate having a first device mounted thereon; a first lead frame formed on the substrate; a second lead frame formed to be spaced apart from the substrate; a post formed on the substrate and formed between the first lead frame and the second lead frame; and a molding part formed to surround the substrate and formed to protrude portions of the first and second lead frames, wherein the post includes a body part bonded to the substrate and a protruding part protruded to an exterior of the molding part.