The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Dec. 24, 2014
Applicant:
Nxp B.v., Eindhoven, NL;
Inventors:
Chanon Suwankasab, Pathumthani, TH;
Amornthep Saiyajiatara, Bangkok, TH;
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49555 (2013.01); H01L 23/3107 (2013.01); H01L 24/49 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/4912 (2013.01);
Abstract
Consistent with an example embodiment, a thin outline shrink package (TSOP) provides for a significant reduction in lead pitch along with a reduced package profile for a semiconductor device die packaged, therein.