The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Jun. 27, 2014
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Akira Okada, Tokyo, JP;

Takaya Noguchi, Tokyo, JP;

Norihiro Takesako, Tokyo, JP;

Kinya Yamashita, Tokyo, JP;

Hajime Akiyama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 31/26 (2014.01); H01L 21/67 (2006.01); G01R 1/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67265 (2013.01); G01R 1/0408 (2013.01);
Abstract

A semiconductor testing jig is provided with a conductive stage including a plurality of mounting portions on which a plurality of vertical semiconductor devices are each individually disposed with lower surface electrodes being in contact with the plurality of mounting portions, an insulating frame portion having a lattice pattern that is disposed on the stage and surrounds each of the plurality of mounting portions in plan view to define each of the mounting portions, and an abrasive layer disposed in a position in the frame portion, the position facing each of the vertical semiconductor devices disposed on the mounting portions.


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