The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Mar. 09, 2011
Applicants:

Ilana Haymov, Netanya, IL;

Nikolay Yaframenko, Rishon Letzion, IL;

Dov Zamir, Beerotaim, IL;

Arkady Garbar, Lakeville, MN (US);

Dmitry Lekhtman, Afula, IL;

Inventors:

Ilana Haymov, Netanya, IL;

Nikolay Yaframenko, Rishon Letzion, IL;

Dov Zamir, Beerotaim, IL;

Arkady Garbar, Lakeville, MN (US);

Dmitry Lekhtman, Afula, IL;

Assignee:

Cima NanoTech Israel Ltd., Industrial Park Caesarea, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); C23C 24/00 (2006.01); B22F 7/04 (2006.01); C23C 24/08 (2006.01); C23C 26/00 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B22F 7/04 (2013.01); C23C 24/08 (2013.01); C23C 26/00 (2013.01); H01B 1/02 (2013.01);
Abstract

A process is disclosed for the delayed sintering of metal nanoparticles in a self-assembled transparent conductive coating by incorporating a sintering additive into the water phase of the emulsion used to form the coating. The sintering additive reduces the standard reduction potential of the metal ion of the metal forming the nanoparticles by an amount greater than 0.1V but less than the full reduction potential of the metal ion. Emulsion compositions used in the process are also disclosed.


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